With fanless Intel® Xeon™ Processor
The MXCS-1 is a high performance, low power and highly integrated rugged Embedded Server, built in a special designed aluminum or MIL IP67 housing. This allows to operate the MXCS in a moderate or harsh environment without fan or air vents. The design integrates standard connectors for easy connection or lockable headers, depending on housing choice. Therefore, the MXCS board can be used for any Server application where a complete solution is needed.
MXCS Highlights
The MXCS housings offer space for up to 8 x 2.5″ SSD. With the internal expansion possibilities over PCI/104-Express interface and the four PCI-Express Mini Card slots, there are unlimited expansion possibilities available. Particular precautions in the design have been taken that the entire system EMC is within the CE and FCC limits and capable to meet the MIL-STD810, 461, 1275, … as well as the standards like IEC60945 or EN50155.
Key features are:
ECC DDR4 up to 128GB
Up to two 1Gbit Ethernet ports
Up to two 10Gbit Ethernet ports
Long term availability
PCIe x16 expansion
Fanless operation
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Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC
Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor
Triple independent display: VGA + HDMI + Optional Display
DDR4 SO-DIMM memory support up to 32 GB
9-36V power module compatible with all-in-one ordering
Optional modular design for 2.5″ hard drive bays: internal /removable (support up to 4 sets)
Advantech iDoor module compatible
Advantech EMIO miniPCIe module compatible with all-in-one ordering
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1U Fanless VMware rugged workstation with Intel® Xeon® D-1587 Processor (16 Cores), 128GB DDR4 ECC RDIMM, MIL-STD 461/1275, 10-Gigabit Ethernet, 6 x Ethernet, Hardware Secure Erase, 12V-40V DC-Input
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Key features are:
9th Generation Intel CPUs
Up to 64GB DDR4 memory (depending on CPU)
Fanless operation, also from -40°C to +75°C
Long term availability (Typically 10 years or more, 20+ years repair)
Extremely flexible
The MILCOTS-4x has been designed to withstand any harsh environments and extreme temperature conditions. The special rugged design, combined with the best industrial-grade components, offer high reliability and long-term performance.
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AMD Ryzen Embedded V1000 COM Express Basic Module Type 6
Dual channel DDR4, Max 32GB (Both ECC & Non-ECC)
Supports Quad independent symmetrical displays (4 4K Displays)
Rich IO Interfaces-2 SATA, 2 USB 3.1 Gen2, 1 USB 3.1 Gen1, 8 USB 2.0, 2 COM, TPM
Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
Intel® Xeon® Processor D-1500 Product Family COM Express® SOM-5992 Basic Module Type 7
COM Express R3.0 Basic Module Type 7 pin out
Up to 16 cores with 45W thermal design power
Dual DDR4 ECC 2400, 1.2V Low Power Memory, Max. 64GB
1 PCIe x16, 1 PCIe x8, 8 PCIe x1, 2 x 10GBASE-KR interface
Supports iManager, Embedded Software APIs and Wise-PaaS/RMM
Intel® Xeon® Processor D-1539 COM Express® SOM-9590 Basic Module Type 7
COM Express R3.0 Basic Module Type 7 pin out
Intel® Xeon® Processor D-1500 Product Family
Solder-down Memory and SSD w/ ECC
High speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
Supports iManager, WISE-PaaS/DeviceOn and embedded software APIs
9th/8th Gen. Intel® Xeon®/Core™ Processor, 3.5″ SBC w/ MIOe
9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W
Dual channel DDR4-2400, up to 64GB, ECC for Xeon SKU
Triple simultaneous displays with 48-bit LVDS+HDMI+DP
USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD
Dual GbE, SATA III, RS-232/422/485, CANBus, SMBus, I2C
M.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230
Supports iManager 3.0 & SW APIs, WISE Paas/DeviceOn
6th Gen Intel® Xeon, Core™ i7/i5/i3 FCBGA1440 Mini-ITX with Dual DP++/HDMI/LVDS(eDP), 2 COM, Dual LAN, PCIe x16, M.2, DDR4, 8 USB3.0 & 1 USB2.0
Supports Intel® Xeon, 6th Gen Core™ i mobile processor (BGA) with Intel QM170/CM236 chipset
Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM
Supports triple display of Dual DP++/HDMI/LVDS(eDP)
Supports PCIe x16 (Gen 3), 2 MiniPCIe, M.2, 8 USB3.0 & 1 USB2.0, 2 SATAIII
Supports Intel vPro, AMT 11.0, TPM 1.2 / 2.0 (optional)
Supports WISE PaaS/RMM and Embedded Software APIs
Intel® Xeon® E3/ 8th & 9th Gen Core™i7/i5/i3 LGA1151, MicroATX with HDMI/2 DP++/eDP (LVDS)/6 COM, 4 LANs,USB 3.1, ATX or 12V DC-IN
Supports Intel® 8th/ 9th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246/H310 chipset
Four U-DIMM sockets support up to 128GB DDR4 2400/2666 MHz SDRAM
Supports HDMI2.0a(option),2 DP++,eDP/LVDS(option) display
Supports Intel AMT 12.0 and Intel vPro competent
Supports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)
Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)
Supports DeviceOn and Embedded Software APIs
6th & 7th Gen Intel® Xeon E3/ Core™ i7/i5/i3 LGA1151 uATX with DVI-D/HDMI2.0/DP++/eDP/VGA, 2 COM, Dual LAN, 8 SATAIII, 1 miniPCIe (mSATA support),10 USB3.0, 2 USB2.0
Supports WISE PaaS/RMM and Embedded Software APIs
Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)
Supports PCIE Gen3, 10 x USB 3.0, 2 USB 2.0, 8 x SATAIII, 1 miniPCIe(mSATA) and dual GbE LAN
Supports Intel AMT 11.0 and Intel vPro competent
Supports DVI-D,HDMI2.0 ,DP++,eDP,VGAdisplay
Four DIMM sockets support up to 64GB DDR4 2133/2400 MHz SDRAM
Supports Intel® Xeon®/ 6th & 7th Gen Core™ i7/i5/i3 processor with C236 chipset
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